发明名称 |
METHOD OF MANUFACTURING POLYPHENYLENE OXIDE, POLYPHENYLENE OXIDE RESIN COMPOSITION, PREPREG, LAMINATE, PRINTED WIRING BOARD AND MULTILAYERED PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a polyphenylene oxide capable of improving moldability when molded and reducing a dielectric constant and a dielectric loss tangent of a cured molded article. SOLUTION: The molecular weight of a polyphenylene oxide is reduced by reacting it with a monofunctional phenol. The polyphenylene oxide having the reduced molecular weight obtained by a decomposition and rearrangement reaction has low polarity and a low dielectric constant and can be used favorably as a molding material for a laminate having a reduced dielectric constant. COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003160662(A) |
申请公布日期 |
2003.06.03 |
申请号 |
JP20010361788 |
申请日期 |
2001.11.27 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
SAITO EIICHIRO;FUJIWARA HIROAKI;YAMAGUCHI MANA;HAYASHI TAKAO;YOSHIMURA TAKESHI;MAEKAWA TETSUYA |
分类号 |
C08J5/24;C08F2/44;C08F283/08;C08G65/48;C08K3/00;C08K5/3477;C08L27/12;C08L71/12;H05K1/03;H05K3/46;(IPC1-7):C08G65/48;C08K5/347 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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