发明名称 METHOD OF MANUFACTURING POLYPHENYLENE OXIDE, POLYPHENYLENE OXIDE RESIN COMPOSITION, PREPREG, LAMINATE, PRINTED WIRING BOARD AND MULTILAYERED PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a polyphenylene oxide capable of improving moldability when molded and reducing a dielectric constant and a dielectric loss tangent of a cured molded article. SOLUTION: The molecular weight of a polyphenylene oxide is reduced by reacting it with a monofunctional phenol. The polyphenylene oxide having the reduced molecular weight obtained by a decomposition and rearrangement reaction has low polarity and a low dielectric constant and can be used favorably as a molding material for a laminate having a reduced dielectric constant. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003160662(A) 申请公布日期 2003.06.03
申请号 JP20010361788 申请日期 2001.11.27
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SAITO EIICHIRO;FUJIWARA HIROAKI;YAMAGUCHI MANA;HAYASHI TAKAO;YOSHIMURA TAKESHI;MAEKAWA TETSUYA
分类号 C08J5/24;C08F2/44;C08F283/08;C08G65/48;C08K3/00;C08K5/3477;C08L27/12;C08L71/12;H05K1/03;H05K3/46;(IPC1-7):C08G65/48;C08K5/347 主分类号 C08J5/24
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