发明名称 |
SEMICONDUCTOR FABRICATION APPARATUS HAVING CONFINEMENT RING |
摘要 |
PURPOSE: A semiconductor fabrication apparatus having a confinement ring is provided to enhance the adhesive strength with a polymer and prevent the contamination of a wafer and a process chamber by forming a concavo-convex portion on a surface of a confinement ring. CONSTITUTION: A process chamber includes an upper chamber and a lower chamber in order to provide a processing area. A cathode is mounted at the upper chamber in order to be used as an electrode. A susceptor is mounted at the lower chamber corresponding to the cathode of the upper chamber. A confinement ring is installed around the cathode. The confinement ring is protruded to a lower portion of the cathode. A concavo-convex portion is formed on a surface of the confinement ring. The concavo-convex portion is formed with hemispheric patterns.
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申请公布号 |
KR20030042551(A) |
申请公布日期 |
2003.06.02 |
申请号 |
KR20010073240 |
申请日期 |
2001.11.23 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SON, SEONG GU |
分类号 |
H01L21/3065;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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