| 摘要 |
PURPOSE: A heat sink and a semiconductor chip package having the same are provided to be capable of keeping a predetermined interval between the heat sink and a semiconductor chip, and connecting the heat sink to the ground part. CONSTITUTION: A heat sink(15) includes a concave portion formed at the lower portion of the heat sink for enclosing at least one semiconductor chip(11) and a plurality of pins(151) prolonged from the edge portion of the lower surface of the heat sink. At this time, each pin includes a neck part(154), an enlarged head part(153), and an opening slot(152) for dividing the pin into the parts. Preferably, a substrate(14) having a plurality of through holes(142), is located at the lower portion of the heat sink. At this time, a ground circuit is connected with the substrate through the holes.
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