| 摘要 |
PURPOSE: A method for coating a photoresist in a semiconductor device is provided to be capable of obtaining a photoresist with good uniformity by adding a low-speed solvent volatilization step in coating recipe. CONSTITUTION: A photoresist coating process comprises photoresist spray preparation step, photoresist spray step and photoresist formation step. At this time, the photoresist coating process further includes an additional solvent volatilization step between the photoresist spray step and the photoresist formation step so as to improve the uniformity of the photoresist without thinning. Preferably, the solvent volatilization step is carried out by decelerating a wafer from 750 RPM to 615 RPM during 19 seconds.
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