发明名称 PALLADIUM PLATING SOLUTION
摘要 PURPOSE: A palladium plating solution is provided which is capable of forming a palladium plating layer whose surface is formed in a needle like crystal shape to obtain superior coherence property of resin. CONSTITUTION: In a palladium plating solution comprising at least soluble palladium salt containing 1 to 60 g/L of palladium, and 0.1 to 300 g/L of sulphamic acid or salt thereof, the palladium plating solution is characterized in that brightener is not substantially contained in the palladium plating solution, wherein the soluble palladium salt is selected from the group consisting of chloride, bromide, iodide, nitrite, nitrate and sulfate of ammine complex salts of palladium. The method for manufacturing a palladium plated article comprises the processes of preparing a plating bath using the palladium plating solution; electroplating a substrate in the plating bath by maintaining a temperature of the plating bath to 30 to 70 deg.C and current density of the cathode to 0.2 to 20 A/m¬2 so that a plating surface having the needle like crystal shaped surface is formed on the substrate; and covering the plating surface having the needle like crystal shaped surface using a sealing resin.
申请公布号 KR20030042956(A) 申请公布日期 2003.06.02
申请号 KR20010073875 申请日期 2001.11.26
申请人 MATSUDA SANGYO CO., LTD. 发明人 UEKI SHINJI
分类号 C25D3/00;(IPC1-7):C25D3/00 主分类号 C25D3/00
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