| 摘要 |
PURPOSE: To provide a method of packaging flexible board allowing high-density package and improvement of the reliability of connection. CONSTITUTION: The method of packaging flexible boards provided with a plurality of flexible boards provided with a wiring pattern 6 being a group of electrodes formed on a non-conductive substrate 1, a group of externally connectable terminals formed in the neighborhood of at least one side of the non-conductive substrate 1 and formed at each electrode end of the electrode group 6, and terminals connectable with the terminal group, and further provided with driving circuits 5 for inputting signals to the electrode group 6 via the terminals, is characterized in including a packaging process in which the flexible board 4 partly overlaps the adjacent flexible boards.
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