| 摘要 |
PURPOSE: A semiconductor device and method for mounting an IC(Integrated Chip) on the semiconductor device are provided to be capable of easily coating a resin layer between an IC and an IC connected part. CONSTITUTION: A semiconductor device is provided with an IC(15) and an end portion(16) opposite to an IC connected part(10) at the peripheral portion of the IC. Preferably, a PCB(Printed Circuit Board) is used as the IC connected part. Preferably, an additional IC is used as the IC connected part. Preferably, the end portion has a depth as much as 1/2 -2/3 times for that of the IC. After simultaneously coating a resin layer(17) at the upper portion of the IC connected part, a flip-chip bonding process is carried out for attaching the IC to the predetermined upper position of the IC connected part.
|
