| 摘要 |
PURPOSE: Lead-free soldering composition is provided to lower a melting point and to improve mechanical characteristic and workability by forming lead-free composition through mixing Cu, Sb and Ag with Sn. CONSTITUTION: Lead-free soldering composition consists of Cu 2-4 wt.%, Sb 2-12 wt.% and Ag 1-3 wt.%, which are mixed with Sb. Ag-alloy has strong penetration property when it is melted, so a strong adhesive surface is achieved. Cu improves wet property, thermal conductivity, conductivity, erosion-resistance property and hardness. Sb is used as a bearing alloy and as an electrode for a battery. If Sb is added more than 3 wt.%, hardness of lead-free soldering composition is remarkably increased. Lead-free soldering composition is heated/stirred in atmosphere by using a pot or a furnace.
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