| 摘要 |
PURPOSE: An apparatus and a method for removing a cover film of an adhesive member of a semiconductor chip are provided to remove automatically a cover film of an adhesive member when mounting a semiconductor chip on a printed circuit board. CONSTITUTION: A plurality of roller(111,112) is located at a start portion and an end portion of a process area for removing a cover film(62) of an adhesive member(60) adhered to a semiconductor chip, respectively. An adhesive tape(130) is connected with both ends of a couple of additional reels(121,122). An inner portion of the adhesive tape(130) is supported by the rollers(111,112). An adhering material is formed on a bottom portion of the adhesive tape(130). A pressing portion(140) is located at an upper end of the process area. The pressing portion(140) is moved selectively to an upper and a lower direction. The pressing portion(140) presses an adhering face of the adhesive tape(130) to the cover film(62) of the adhesive member(60).
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