发明名称 DIELECTRIC STRUCTURE
摘要 PURPOSE: A dielectric structure is provided to improve the adhesion of plated electrode layers to high dielectric constant material by providing increased surface roughness of the dielectric material. CONSTITUTION: A capacitance material comprises a multiplayer dielectric structure comprising a first dielectric layer and a second dielectric layer, wherein the first dielectric layer has a textured surface. The least one of the first and second dielectric layers is selected from the group consisting of polymers, ceramics, metal oxides and combinations thereof.
申请公布号 KR20030043714(A) 申请公布日期 2003.06.02
申请号 KR20020073710 申请日期 2002.11.26
申请人 SHIPLEY COMPANY, L.L.C 发明人 ALLEN CRAIG S.;RZEZNIK MARIA ANNA;JACQUES DAVID L.
分类号 H01G4/20;H01G4/06;H05K1/16;H05K3/18;H05K3/38;(IPC1-7):H05K1/16 主分类号 H01G4/20
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