| 摘要 |
PURPOSE: To overcome a problem where when forming electrical connection paths with an outside of a device by connecting a chip to a leadframe, lead terminals of the leadframe corresponding to each pad formed on the chip are necessary and these are wirebonded to each other with a one-to-one correspondence, and thus if a pitch of pads, for example, is different for each chip, the leadframe must be made for each chip. CONSTITUTION: A semiconductor device of the invention comprises pattern sections for electrical connection, which consist of a plurality of lead patterns that are formed on a mounting region of a support member, are arrayed longer than the length of the column of terminals for electrical connection with a smaller pitch than an array pitch of the terminals for electrical connection of a semiconductor chip, and each have a smaller width than the array pitch of the terminals for electrical connection, where when the semiconductor chip is mounted on a mounting surface, the lead patterns, while keeping non- continuity between respective terminals for electrical connection, contact the respective terminals. |
