| 摘要 |
PURPOSE: A method for exposing a semiconductor device is provided to enhance the reliability of the semiconductor device and increase a process margin by performing the second exposure for inferior patterns after performing the first exposure process. CONSTITUTION: The first exposure process is performed on patterns(35) of the first region under an optimum exposure condition by using a reticle and an aperture. The patterns are formed by performing the double exposure process on the patterns formed on two regions under the optimum exposure condition by using the reticle and the aperture. The patterns are formed by performing the double exposure process on the patterns formed on two regions under the optimum exposure condition by using two reticles and two apertures.
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