PURPOSE: An electrostatic chuck is provided to prevent burning of an edge portion of a wafer by using a cooling portion having a larger area than the area of a wafer. CONSTITUTION: A cooling portion(138) having a larger area than the area of a wafer(1) and an electrostatic chuck electrode(140) are installed in the inside of an electrostatic body(136). A helium panel(132) having groove patterns is located at an upper portion of the electrostatic chuck body. A coolant inflow tube(139a) and a coolant outflow tube(139b) are connected with the cooling portion. A DC voltage bar(141) is used for applying a DC voltage to the electrostatic chuck electrode. A helium inflow tube(133a) and a helium outflow tube(133b) are used for performing the inflow and the outflow of helium from or to the groove patterns.
