| 摘要 |
PURPOSE: A tray for BGA type chip scale package is provided to increase a guiding range of the chip scale package and improve the loading possibility of the chip scale package by forming a plurality of guide walls at sides of a rib. CONSTITUTION: A tray(10) includes a body(11), a plurality of pockets(13), a rib(17), and a plurality of guide walls(23) in order to receive a ball grid array package. The body has a shape of rectangular plate. The pockets are arrayed in matrix. The rib has a loading side on which balls are loaded. The guide wall is formed at each side of the rib. The guide wall is higher than the rib in the height. The rib has a shape of rectangular ring on which the balls of the chip scale package are loaded. In addition, the rib has an auxiliary having a shape of bar crossing rib facing sides.
|
