| 摘要 |
PURPOSE: A semiconductor device is provided to be capable of downsizing a chip or a package. CONSTITUTION: A semiconductor device is provided with an insulating support substrate(1), a semiconductor chip having a plurality of electrode pads at the surface portion, a plurality of conductive patterns(2) formed at the upper portion of the insulating support substrate corresponding to each electrode pad of the semiconductor chip, a connection part for connecting the electrode pads with the conductive patterns, and a plurality of outer connection electrodes corresponding to each conductive pattern. At this time, the semiconductor chip is fixed at a fixing portion(11) of at least one conductive pattern by using an insulating resin. |
