RHEOLOGICAL MODIFIER FOR LAPPING SLURRY

摘要

PURPOSE: A rheological modifier for lapping slurry is provided to be capable of swiftly and uniformly polishing a wafer surface, preventing scratches of the wafer surface, and removing the residual of a lapping process. CONSTITUTION: A modifier is composed of bridge polyacrylic acid of 0.1-3 weight percentage, nonyl phenol of 0.1-3 weight percentage, triethanolamine of 1-5 weight percentage, polyethylene glycol of 5-20 weight percentage, silicon glycol polymer of 0.1-3 weight percentage, an ammonia in aqueous solution of 0.5-5 weight percentage, and water. The modifier is obtained by sequentially adding and mixing the nonyl phenol, the triethanolamine, the polyethylene glycol, the silicon glycol polymer and the ammonia in aqueous solution to a dispersing solution containing bridge polyacrylic acid and water. At this time, the bridge polyacrylic acid is slowly added and dispersed in water using a propeller-type mixer for preventing scratches of a wafer surface due to a lapping process.