发明名称 METHOD FOR MOLDING RESIN-MOLDED PRODUCTS BY MOLD DEVICE, MOLD DEVICE, RESIN-MOLDED PRODUCTS, AND MOLDING MACHINE HAVING MOLD DEVICE
摘要 PURPOSE: A method for molding resin-molded products by using a mold device, the mold device, resin-molded products, and a molding machine having the mold device are provided to equalize the pressure distribution of resin, to improve the orientation of resin molecules and the electronic property of a mold surface, to prevent resin from being contracted, and to reduce residual stress. CONSTITUTION: A method for molding resin-molded products by using a mold device(100) is composed of steps of starting to fill resin into a cavity forming part(37) of the mold device before a mold closing process is finished; finishing the mold closing process after filling the resin into the cavity forming part of the mold device is finished; and implementing a mold clamping process after the mold closing process is finished.
申请公布号 KR20030043699(A) 申请公布日期 2003.06.02
申请号 KR20020073393 申请日期 2002.11.25
申请人 SUMITOMO HEAVY INDUSTRIES, LTD.;YOSHINO KOGYOSHO CO., LTD. 发明人 SASAKI TSUYOSHI;WATANABE OSAMU;TAKIGAWA NAOKI
分类号 B29C45/70;B29C33/00;B29C45/14;B29C45/26;B29C45/56;(IPC1-7):B29C45/70 主分类号 B29C45/70
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