SEMICONDUCTOR PACKAGE, FABRICATING METHOD THEREOF, AND STACKED SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package, a fabricating method thereof, and a stacked semiconductor package are provided to reduce the thickness of the semiconductor package by removing a substrate such as a printed circuit board or a lead frame. CONSTITUTION: A conductive trace includes a bond pad(12b) and a ball land(12a). The bond pad is contacted with a metal pad of a semiconductor chip(11). The ball land outputs an electrical signal to the outside along a path connected with the bond pad. A gap between the bond pad and the semiconductor chip is filled with an adhesive member(15). A sealant(16) is used for sealing the semiconductor chip and the outside of the ball land except for a ball land region. A conductive ball(18) is adhered on the ball land. The adhesive member is formed with an anisotropic conductive film, a non-conductive film, an isotropic conductive film, and an epoxy.