发明名称 METHOD OF INSPECTING MARK, APPARATUS FOR INSPECTING MARK, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of inspecting marks with which the marks can be accurately and easily measured. SOLUTION: This method of inspecting the marks comprises a step of radiating a charged-particle beam to a first region containing at least a part of a material film 5 formed on a first mark 1, a step of radiating a charged-particle beam to a second region containing at least a part of second marks, a step of obtaining a first signal that corresponds to the first mark by detecting secondary charged particles generated by the charged-particle-beam radiation to the first region, a step of obtaining a second signal that corresponds to the second marks by detecting secondary charged particles generated by the charged-particle-beam radiation to the second region, a step of deriving the quantity of the misalignment between the first mark and the second marks based on the first signal and the second signal, and a step of deriving the size of the second marks based on the second signal. The conditions for the charged- particle-beam radiation to the first region and to the second region are different.
申请公布号 JP2003158163(A) 申请公布日期 2003.05.30
申请号 JP20010358328 申请日期 2001.11.22
申请人 TOSHIBA CORP 发明人 KOIKE TORU
分类号 G01B15/00;H01J37/28;H01L21/027;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01B15/00
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