| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor package employing flip-chip mounting curing flux which does not need washing to remove remaining flux after soldering, can maintain the electrical insulation even in a high temperature and high humidity environment, and enables solder connection with high strength and high reliability when a semiconductor chip is mounted on a mounting board with flip-chip mounting, and to provide a semiconductor device using the package. SOLUTION: This flip-chip mounting curing flux functions as flux when a semiconductor chip, on which solder bumps for mechanical and electrical connections are formed, is mounted on a semiconductor package board, on which lands for connection with the solder bumps are formed, with flip-chip mounting by a solder reflow method and is cured by heating.
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