| 摘要 |
PROBLEM TO BE SOLVED: To provide a method which hardly causes the breakage (including the chipping) of thin layer sheets near a via when peeling a carrier tape, regardless of the multilayer structure and reduction in thickness of ceramic green sheets. SOLUTION: The method comprises steps of (1) stacking the prescribed number of sheets 5 and internal electrodes 6 alternately on a sheet 1 which will become a first base section to form a multilayer section 7, (2) applying a sheet 14 which will become a second base section on the multilayer section 7 to fabricate a finally required laminate 12 wherein the prescribed number of sheets and internal electrodes are alternately stacked, (3) in the laminate 12 forming a blind via hole 4 from the first base section 1 or the second base section 14, so that the hole passes through the multilayer section 7 and then stops in the middle of the second base section 14 or first base section 1 or in the middle of the multilayer section 7, and (4) filling in the blind via hole 4 with a conductive material to form a via electrode 13.
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