BASE MATERIAL FOR WAFER DICING TAPE

摘要

PROBLEM TO BE SOLVED: To provide a base material for a wafer dicing tape capable of preventing generation of thread-like waste in dicing with excellent uniform expansion property and restoration property at the time of expansion and an excellent slide property with an expansion ring, and the wafer dicing tape. SOLUTION: The base material for the wafer dicing tape is composed by stacking an adhesive material coating layer, an intermediate layer and an expansion ring contact layer in the order.