发明名称 SOLDERING METHOD FOR PRINTED BOARD AND JET SOLDERING BATH
摘要 PROBLEM TO BE SOLVED: To reduce failure in soldering by using not only one type of jet nozzle suggested by a soldering device maker but some jet nozzles fit for each printed board, related to soldering of variety of printed boards used for an electronic equipment. SOLUTION: In this soldering method, the jet nozzle fit for soldering each printed board is selected to solder, so that failure in soldering is decreased. Related to a jet soldering bath, the jet nozzle is composed of a wave making part and a base, so that the wave making part is easily exchanged with that fit for the printed board to solder. Further, because the jet nozzle is divided into the wave making part and the base, cleaning for oxides is easily done.
申请公布号 JP2003158369(A) 申请公布日期 2003.05.30
申请号 JP20010358362 申请日期 2001.11.22
申请人 SENJU METAL IND CO LTD 发明人 ZEN MITSUO;NIKAIDO TAKAYUKI;OGAWA TADAMICHI
分类号 B23K1/08;B23K101/40;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/08
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