| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet which is suitable for the use in additive processing, enables a formerly difficult copper-foil direct processing with a laser, and is excellent in productivity and suitable e.g. as a printed circuit board material. SOLUTION: This adhesive sheet comprises an epoxy resin composition sheet formed into a film and an extremely thin, 50 nm- to 1,000 nm-thick metal film formed on at least one side of the epoxy resin composition sheet.
|
