| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device inspection method for performing a burn-in test to a specific electronic device in electronic devices that are being mounted to electronic equipment without using any constant temperature ovens. SOLUTION: While a lid 1 is being fitted to a CPU package 4 on a mother board 2 in a computer, a computer apparatus is operated. Since the large part of a fin 5A in a heat sink 5 is covered with the lid 1, cooling efficiency due to the heat sink 5 greatly decreases, and the temperature of the CPU in the CPU package 4 increases as compared with actual use due to self heat generation to reach a high-temperature state. As a result, an electric signal as in the actual use is applied to the CPU in a high-temperature state, and a burn-in test suited for an initial failure mechanism is performed. No lid is fitted to a crystal oscillator 12 and an electrolytic capacitor 13 that should not reach a high-temperature state, thus preventing the high-temperature state.
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