| 摘要 |
PROBLEM TO BE SOLVED: To provide a palladium electroplating method which enables palladium plating on copper alloy such as lead frame uniformly and thinly. SOLUTION: In this palladium electroplating method, metal material is subjected to nickel plating, is surface treated with a reaction product of N- containing heterocyclic azole compound and epoxy silane compound, and palladium chloride and is subjected to palladium electroplating. Otherwise, after the nickel plating, the metal material is subjected to palladium electroplating and then, as post-treatment, is surface treated with a reaction product of N- containing heterocyclic azole compound and epoxy silane compound, and palladium chloride. The reaction product used in the surface treatment is preferably imidazole silane which, in particular, is an equimolar reaction product of imidazole andγ-glycidoxy propyl trimethoxy silane.
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