METHOD AND APPARATUS FOR SECURING A CIRCUIT BOARD TO A RIGID SURFACE

摘要

A multiple cure adhesive 204 is used to secure a circuit substrate 104 to an underlying rigid surface 106. The adhesive is screen printed on the underlying surface 304. A first cure is then applied to the adhesive to at least partially cure the adhesive and to render the adhesive tacky 306. The circuit substrate 104 is mounted on the tacky adhesive 308 and a second cure is applied to the adhesive 314 to firmly secure the circuit substrate 104 to the housing 106.