发明名称 |
Fabrication of electronic component incorporating inductive microcomponent, e.g. inductor or transformer, comprises etching copper-diffusion barrier layer between turns of inductive microcomponent |
摘要 |
Electronic component incorporating inductive microcomponent is manufactured by etching copper-diffusion barrier layer (15) between turns (30, 31) of inductive microcomponent. Fabrication of electronic component incorporating inductive microcomponent, comprises: (i) depositing layer of material having low relative permittivity on substrate (1); (ii) depositing layer (12) forming hard mask; (iii) forming aperture in the hard mask vertically above the metal pads; (iv) etching the layer on material having low relative permittivity down to metal pad to form interconnection hole or via; (v) depositing layer forming copper barrier diffusion; (vi) depositing copper primer layer; (vii) depositing protective mask and removing it from the bottom of the via; (viii) depositing copper electrolytically in the via; (ix) removing the rest of the protective mask; (x) depositing top resist layer with thickness similar to the thickness of turns of the inductive microcomponent; (xi) etching the resist layer to form channels defining geometry of turns of the inductive microcomponent; (xii) depositing layer electrolytically in the etch channels; (xiii) removing the rest of the top resist layer; (xiv) etching the copper primer layer between copper turns; and (xv) etching copper-diffusion barrier layer between turns of inductive microcomponent. |
申请公布号 |
FR2832853(A1) |
申请公布日期 |
2003.05.30 |
申请号 |
FR20010015458 |
申请日期 |
2001.11.29 |
申请人 |
MEMSCAP |
发明人 |
GIRARDIE LIONEL;DAVID JEAN BAPTISTE |
分类号 |
H01F17/00;H01F41/04;H01L21/3205;H01L21/822;H01L23/52;H01L23/522;H01L23/532;H01L27/04 |
主分类号 |
H01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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