| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer manufacturing method of a copper foil clad substrate wherein a very thin copper foil (from 6μm to 1μm) is installed and damage of the copper foil can be avoided in dealing of the copper foil clad substrate in the course of transfer and execution of contact bonding, and to provide copper foil transfer material used for the method. SOLUTION: In this transfer manufacturing method of the copper foil clad substrate, the copper foil transfer materials are formed by mounting copper foils on the respective first surfaces of planar carrier plates as two media, the copper foil transfer materials are made intermediate members, the surfaces on which copper foils of the two copper foil transfer materials are mounted are made to face different surfaces of a substrate respectively, pressure is adjusted under heating, and the copper foils are transferred and stuck on both surfaces of the substrate. In the mounting of the copper foils to the surfaces of planar carrier plates, a metal film vapor deposition process wherein metal films as mediation layers are formed on the surfaces of the carrier plates by using a vapor deposition method, and if necessary, a copper plating process wherein copper plating films are formed by plating further on the surfaces on which the metal films are formed are contained.
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