| 摘要 |
<p>The invention concerns an inexpensive method for making electronic modules suitable for large-scale production. The inventive method consists in making an electronic module comprising at least an electronic component (4) and a layer formed by a binder, the electronic component (4) having an exposed side at the surface of the module. The invention is characterized in that it consists in setting a frame (3) on a protective sheet (2) arranged on a base plate (1); then in setting at least an electronic component (4) on the protective sheet (2) and inside the frame (3); pressing a pressure plate (6) on the periphery of the frame (3) before inserting the binder between the orifices (5) drilled in the frame (3). Said binder coats the electronic component (4) by filling the gap defined by the frame (3), the protective sheet (2) and the pressure plate (6).</p> |
