| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need for sticking a heat-resistant tape to the rear surface of a lead frame and, in addition, to prevent the occurrence of interface peeling caused by thermal stresses at the time of mounting a semiconductor chip on the lead frame. SOLUTION: The portion of the lead frame sealed with a sealing resin and another portion of the lead frame on which the semiconductor chip is mounted are covered with a coating resin. |
