发明名称 ELECTRONIC PARTS MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic parts mounting device capable of mounting electronic parts on a substrate by shortening a tact time by using a transfer head equipped with a plurality of nozzles. SOLUTION: This device is provided with positioning means 2 and 3 for positioning a substrate 4, a parts feeder 5 for feeding electronic parts to be mounted on the substrate 4, a transfer head 10 equipped with a plurality of nozzles for absorbing the electronic parts for picking up the electronic parts from the parts feeder 5 and for mounting the electronic parts on the substrate 4 positioned by the positioning means 2 and 3, moving means 8 and 9 for relatively moving the substrate 4 and the transfer head 10, and a line image sensor 11 for imaging the electronic parts absorbed by the nozzles of the transfer head 10 during one time moving operation of the transfer head 10.
申请公布号 JP2003158398(A) 申请公布日期 2003.05.30
申请号 JP20020283164 申请日期 2002.09.27
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAGUCHI HIROYUKI
分类号 H05K13/04 主分类号 H05K13/04
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