发明名称 ELECTRONIC CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a structure wherein an occupied area in a substrate can be reduced and assembly is easy. SOLUTION: Electrical connection between substrates 3, 4 is performed by using a flexible cable 5, and besides, the substrates 3, 4 are held in a face-to-face attitude by using a spacer 6. Since function regarding mechanical connection or relative positioning between the substrates 3, 4 and function regarding electrical connection between the substrates 3, 4 are isolated from each other, size (especially thickness) of the spacer 6 which performs the mechanical connection or the relative positioning can be miniaturized (thinned) as far as a necessary and minimum limit for relative positioning between the substrates 3, 4, and an occupied area of the spacer 6 in the substrates 3, 4 can be reduced. Since electrical connection between the substrates 3, 4 is performed by using the flexible cable 5, ensuring electrical connection in assembling processes is unnecessary, and the assembling processes can be facilitated.
申请公布号 JP2003158356(A) 申请公布日期 2003.05.30
申请号 JP20010355013 申请日期 2001.11.20
申请人 MURATA MFG CO LTD 发明人 SHINKAI MASAKI
分类号 H05K1/18;H05K1/14;(IPC1-7):H05K1/14 主分类号 H05K1/18
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