| 摘要 |
PROBLEM TO BE SOLVED: To effectively cool an electronic or optoelectronics device without an increase of the cost and a space. SOLUTION: An electronic device such as a laser diode is mounted on heat sink assemblies (126, 128) in a TO can package. The TO can package is coupled with a thermal sink (146) such as a printed circuit board or a housing through a heat conductor. The heat conductor is configured into a thermal clip (140), and a flexible band (404) or a substitute heat pipe (306). Thermal energy is hereby effectively taken out from each device in the TO can package (402). |
