发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ALIGNER
摘要 PROBLEM TO BE SOLVED: To prevent an imperfect pattern from being formed while restraining decrease of product yield. SOLUTION: Masking blade equipment 40 of a stepper is provided with a pair of a first blade 43 and a second blade 44 whose plane view is L-shaped, and a third blade 47 which is moved independently of the blades 43, 44. When a place related to an edge of a wafer 1 is exposed, the first blade 43, a second blade 44 and the third blade 47 are suitably moved in the XY direction, and a translucent window 45 is set in a polygon wherein a part of a square of a one-shot pattern 52 of a reticle 50 is notched, so that a deformed exposure image 62 wherein a chip 53 is not related to the edge of the wafer is formed. By evading the formation of the chip related to the edge of the wafer, the occurrence of exfoliation or the like of an imperfect chip can be prevented. By restraining the number of chips which are not formed to a minimum, decrease of the product yield can be restrained to a minimum.
申请公布号 JP2003158067(A) 申请公布日期 2003.05.30
申请号 JP20010357908 申请日期 2001.11.22
申请人 HITACHI LTD 发明人 NAGAI TOSHIHIRO;YAMAMOTO KOJI;NEMOTO SHOJI;YANATORI SHUICHI
分类号 G03F7/22;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/22
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