发明名称 HIGH DENSITY PLANAR ELECTRICAL INTERFACE
摘要 An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.
申请公布号 WO03001223(A3) 申请公布日期 2003.05.30
申请号 WO2002US19347 申请日期 2002.06.18
申请人 FORMFACTOR, INC.;ELDRIDGE, BENJAMIN, N.;MILLER, CHARLES, A. 发明人 ELDRIDGE, BENJAMIN, N.;MILLER, CHARLES, A.
分类号 G01R1/04;G01R1/067;G01R1/073;G01R31/26;H01B1/00 主分类号 G01R1/04
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