| 摘要 |
<p>The present invention contemplates methods of bonding devices that produce sonic energy to polymer articles (Fig. 2B), the bonded articles themselves, methods for fabricating a semiconductor processing apparatus, and the apparatus itself. The present invention provides for an apparatus comprised of polymers, which is not susceptible to corrosion and permit the transmission of sonic energy through the walls of the apparatus. The polymer can be, for example, a fluoropolymer (Fig. 2B).</p> |
