| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board with a heat sink in which a conductor layer for a ground or a power source coating on the lower surface of an insulating base is electrically and mechanically rigidly connected to the heat sink made of metal, and a semiconductor element to be placed can be normally operated for a long period. SOLUTION: The circuit board with the heat sink comprises an insulating board 1 having a through hole 4a for containing the semiconductor element at the center, a plurality of wiring conductors 5 covering from the periphery to the outer periphery of the hole 4a of the upper surface of the board 1, a ground or a conductor layer 6 for the power source covering the lower surface of an insulating plate 4, an insulating layer 12 partly covering the lower surface of the layer 6 and made of a thermosetting resin, and the heat sink plate 2 made of a metal adhered to a connecting layer 16 made of a conductive filler and the thermosetting resin so as to block the hole 4a to the layer 6 and the layer 12. The insulating layer 12 becomes an anchor, and the conductor layer 6 is rigidly brought into close contact with the layer 15. |
