发明名称 METHOD AND SYSTEM FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method, apparatus and system for treating a substrate, which contribute to improvement of uniformity of line width even in environment in which impurities of molecule level are present. SOLUTION: Before a wafer W is transferred to an exposure device which exposes resists on the wafer W, the wafer W coated with the resist in a treating chamber R is exposed to vapor supplied from a vapor generator 35 and then the vapor, for example, moisture is adsorbed uniformly by the resist on the wafer W, so uniform exposure is carried out in a subsequent exposure process, so that the uniformity of line width on the wafer W can be improved.
申请公布号 JP2003156858(A) 申请公布日期 2003.05.30
申请号 JP20010358183 申请日期 2001.11.22
申请人 TOKYO ELECTRON LTD 发明人 MATSUI HIDEAKI;KITANO JUNICHI
分类号 G03F7/38;H01L21/00;H01L21/027;H01L21/677;(IPC1-7):G03F7/38 主分类号 G03F7/38
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