发明名称 SURFACE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment device where uniform gas flow distribution can be formed, gas discharge mechanism superior in the controllability of the temperature of a gas plate and the distribution and uniform treatment can continuously be performed. SOLUTION: The surface treatment device is constituted of a treatment chamber where a substrate placing mechanism on which a substrate is placed inside and the gas discharge mechanism are oppositely arranged, and of the exhaust means and the gas supply means of the treatment chamber. In the gas discharge mechanism, a gas dispersion mechanism, the cooling or heating mechanism of the gas plate where multiple gas routes are given and a refrigerant channel or a heater is disposed and the gas plate having multiple gas blow holes connected to the gas channels are disposed in order from an upstream side. The gas plate is fixed to the cooling or heating mechanism by a grasping member grasping the peripheral part of an electrostatic adsorption mechanism or the gas plate. A second gas dispersion mechanism is disposed between the gas plate and the cooling or heating mechanism and gas blow holes are made just below the refrigerant channel.
申请公布号 JP2003158120(A) 申请公布日期 2003.05.30
申请号 JP20020247948 申请日期 2002.08.28
申请人 ANELVA CORP 发明人 SAGO YASUMI;IKEDA MASAYOSHI;KANEKO KAZUAKI;KONDO DAISUKE;MORITA OSAMU
分类号 C23C16/455;H01L21/205;H01L21/3065;(IPC1-7):H01L21/306 主分类号 C23C16/455
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