| 摘要 |
The invention relates to an arrangement of a semiconductor component on a substrate, whereby the substrate (30) comprises contact surfaces (32) on an assembly side (31). The semiconductor component comprises a first chip (10) and at least one second chip (20), whereby the second chip (20) is arranged on the first chip (10). The first and the second chip (10, 20) are thus electrically connected to each other. Furthermore the first chip (10) comprises contact surfaces (12) on the first main side (11) thereof, with which the above faces the assembly side (31) of the substrate (30). The contact surfaces of the first chip (10) are electrically connected to the corresponding contact surfaces (32) of the substrate (30) by means of a jointing agent. |
