发明名称 PRESSING APPARATUS FOR MULTILAYER CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a pressing apparatus for a multilayer ceramic electronic component which has only a little deformation in a punch and can easily obtain a constant surface pressure at a pressing face. SOLUTION: The pressing apparatus 1 comprises a rigid pressing metal mold 2 mainly consisting of a lower metal mold 3, a frame 4, and an upper metal mold 5; upper punch 11; lower punch 12; rod 15 for a lower punch; and driving unit (not shown in the figure) for moving the rod 15 for a lower punch in the up and down direction by hydraulic pressure or air pressure. An end 15a of the rod 15 for a lower punch is tapered narrowly toward the end. The area and shape of an end face 15S of the rod 15 for a lower punch is nearly the same as that of a pressing face which is a part where the upper metal mold 5 and the lower metal mold 3 of the pressing metal mold 2 are opposite to each other and pressing pressure is applied on a work 20, more specifically, a region indicated by a sign 2S in Figure 1.
申请公布号 JP2003158040(A) 申请公布日期 2003.05.30
申请号 JP20010353595 申请日期 2001.11.19
申请人 MURATA MFG CO LTD 发明人 KAWABATA NAOAKI
分类号 B30B7/00;H01G4/30;(IPC1-7):H01G4/30 主分类号 B30B7/00
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