| 摘要 |
PROBLEM TO BE SOLVED: To provide an elastic electric contact point through which, a semiconductor board can surely be connected and quickly mounted to a circuit board. SOLUTION: The elastic electric contact point 1 is formed by covering a quadrilateral pyramid-shaped elastic member 2 by a conductive film 3, and sticking gold plated parts 31, 32 to a flat part 30 of the conductive film 3 and to a top end. By the above, the gold plate part 31 of the elastic electric contact point 1 is made to contact with an electrode of the semiconductor board and the gold plate part 32 is made to contact with a land of the circuit board or the like. The semiconductor board can be electrically connected to the circuit board through the elastic electric contact point 1 by pressing the semiconductor board or the circuit board.
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