| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe package structure of a probe card, which provides superior electromagnetic shield effect for shielding against electromagnetic interference, a superior shield protection effect enough to effectively reduce the electromagnetic interference between probes, enabling the probes to act normally respectively and effectively improves the test yield of chips. SOLUTION: The probe package structure of a probe card comprises electrodes for coupling probes on an electric circuit board, each probe is exposed at the other end, to inspect pads of a chip in a wafer and wrapped with an insulation layer and a metal wrapping layer, and the insulation layer wraps the outside of each probe and the metal wrapping layer wraps the outside of the insulation layer.
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