发明名称 HEAT SINK AND FAN DEVICE USING IT
摘要 PROBLEM TO BE SOLVED: To provide a heat sink that can be reduced in pressure loss and improved in cooling efficiency, and to provide a fan device using the heat sink. SOLUTION: In the heat sink which radiates the heat generated from electronic parts D through a plurality of heat radiating fins 2 erected on a base 5 set up on the parts D, the fins 2 are arranged in orthogonal X and Y directions and the fins 2 adjoining each other in the X-direction are inclined in the direction opposite to the inclined direction of the fins 2 arranged in the Y-direction.
申请公布号 JP2003158228(A) 申请公布日期 2003.05.30
申请号 JP20010358100 申请日期 2001.11.22
申请人 NIPPON DENSAN CORP 发明人 OTSUKI TAKANARI;TAKESHITA HIDENOBU
分类号 H05K7/20;H01L23/36;(IPC1-7):H01L23/36 主分类号 H05K7/20
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