发明名称 |
HEAT SINK AND FAN DEVICE USING IT |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink that can be reduced in pressure loss and improved in cooling efficiency, and to provide a fan device using the heat sink. SOLUTION: In the heat sink which radiates the heat generated from electronic parts D through a plurality of heat radiating fins 2 erected on a base 5 set up on the parts D, the fins 2 are arranged in orthogonal X and Y directions and the fins 2 adjoining each other in the X-direction are inclined in the direction opposite to the inclined direction of the fins 2 arranged in the Y-direction.
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申请公布号 |
JP2003158228(A) |
申请公布日期 |
2003.05.30 |
申请号 |
JP20010358100 |
申请日期 |
2001.11.22 |
申请人 |
NIPPON DENSAN CORP |
发明人 |
OTSUKI TAKANARI;TAKESHITA HIDENOBU |
分类号 |
H05K7/20;H01L23/36;(IPC1-7):H01L23/36 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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