| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component which hardly causes defects including warpages regardless of the multilayer structure and reduction in thickness of ceramic green sheets. SOLUTION: When a second conductor powder for wiring pattern layers 6 which is to be formed in layers on ceramic green sheets 5 is formed of only metal powder particles MP, shrinkage of the powder progresses rapidly due to the diffusion or melting of the metal particles at a burning temperature appropriate for ceramic and thereby the warpages or other problems occur. By putting inorganic compound powder particles CP having the average grain diameter of 500 nm or below into the second conductor powder, shrinkage of the wiring pattern layers 6 can be delayed moderately when baking the ceramic green sheets 5 in a multilayer state, effectively preventing the occurrence of the warpages or other problems. Furthermore, by filling in via holes 39, each of which is extended over a plurality of ceramic green sheets 5 with the first conductive powder in a batch, the via electrodes can be formed efficiently in a short time.
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