发明名称 HEAT-DEVELOPABLE PHOTOSENSITIVE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a heat-developable photosensitive material which has improved resistance to scuffing, particularly scuffing immediately after heat development, film sticking and bleed-out. SOLUTION: The heat-developable photosensitive material uses, as a binder, a polyvinyl butyral resin containing 2 to 20 parts by mass of an ethylene oxide adduct of the formula RO-(CH2 CH2 O)n -H (where R is a 1-24C alkyl or a 0-18C alkyl substituted aryl and n is 1 to 10).
申请公布号 JP2003156813(A) 申请公布日期 2003.05.30
申请号 JP20010353127 申请日期 2001.11.19
申请人 KONICA CORP 发明人 UEDA EIICHI;NAGAIKE CHIAKI;NAKAJIMA AKIHISA;HOSOI YUJI;KURACHI IKUO
分类号 G03C1/498;G03C1/76;(IPC1-7):G03C1/498 主分类号 G03C1/498
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