| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which the size is reduced and which does not have continuity faults. SOLUTION: The semiconductor device comprises a first electrode for bonding a semiconductor element and a second electrode connected to the element via a bonding wire formed on the front surface of a substrate, back surface electrodes corresponding to the first and second electrodes formed on the back surface of the substrate in such a manner that the first and second electrodes are electrically connected to the back surface electrodes corresponding to these electrodes via bumps formed to pass through the substrate in a perpendicular direction to the planar surface of a substrate, and the element, the bonding wire and first and second electrodes sealed with a transparent resin. |
