| 摘要 |
PROBLEM TO BE SOLVED: To facilitate coating by widening the range of the optimum amount of a resin applied between a member to be connected and an IC, in a semiconductor device in which the IC is connected to the part to be connected through flip chip connection. SOLUTION: In the semiconductor device, the IC 15 is connected to a TAB tape 10 (circuit substrate) or another member to be connected such as another IC or the like through flip chip connection. Step sections 16 faced to the opposite side of the member to be connected are formed on the outer periphery of the IC. The depth of the stepped part can be specified so as to be 1/2-2/3 times of the thickness of the IC. |
