发明名称 Method of inspecting curved surface and device for inspecting printed circuit board
摘要 A circuit board with lead-free solder is inspected by using light sources with different colors at different angles to obtain an image having a plurality of color components. For each pixel within an area in the obtained image, the brightness of a white component generated by mixing all of the color components is extracted. The brightness of each of the color components of each pixel is reduced by an amount corresponding to the extracted brightness of the white component and is adjusted such that the brightest of the color components becomes more strongly emphasized compared to the others, than the brightness before the brightness-reducing process was carried out and the loss in total brightness caused by the brightness-reducing process is restored. The image with restored brightness is displayed and the surface condition of the solder is judged on the basis of the distributions of the color components of this image.
申请公布号 US2003099393(A1) 申请公布日期 2003.05.29
申请号 US20020299570 申请日期 2002.11.18
申请人 OMRON CORPORATION 发明人 OSHIUMI AKIRA;FUJII YOSHIKI;FUJITA YUJIN
分类号 G01N21/27;G01N21/956;G01R31/309;(IPC1-7):G06K9/00 主分类号 G01N21/27
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